The IX-200 ChromaDiceT DPSS version is a high-precision wafer dicing (singulation) system also suitable for wafer trimming and scribing applications. Its UV diode-pumped solid-state (DPSS) laser system delivers high-speed wafer dicing and cutting with typical yields greater than 99 % at less than $ 2 per wafer. The process is tolerant of wafer warp and bow and suitable for all wafer types. The IX-200 system is also available in an excimer laser version for via drilling, micro-machining, thin film patterning and many other semiconductor packaging applications including LED liftoff.
EPP Europe 455
