The paste features a halogen-free (ORH0) formulation with no halogen intentionally added, ensuring compliance with global environmental regulations, such as RoHS, RoHS 2.0, and REACH. An additional advantage of note is its ease of cleaning. Residue can be effectively removed using only water heated to 60°C. This simplifies post-soldering processes and supports cleaner, more sustainable manufacturing environments.
The solder paste also delivers optimal voiding performance, excellent solderability, and high print consistency. These characteristics help improve yields and ensure strong, reliable joints across a wide range of surface finishes and component types. The paste is well-suited to surface mount and ground pad soldering in applications where low ionic residue and high-quality solder joints are critical; for example, within the fields of telecommunications, automotive electronics, industrial control systems, and medical devices.
Watson Tseng, General Manager at the company, commented: “PF606-PW220 addresses the industry’s growing need for clean, lead-free solutions that also deliver top-tier performance. Its ease of cleaning and outstanding void control make it an excellent choice for manufacturers focused on high reliability.”
