Additionally, the company was a proud sponsor of this year’s Test Vision Symposium and Workforce Development program and will continue its participation in SEMI’s Semiconductor Climate Consortium (SCC) as one of the founding members.
Exhibition highlights
The company’s product showcase featured its comprehensive portfolio of test solutions that address industry challenges in the era of complexity, including:
- AI/HPC device test solutions, including the V93000 EXA Scale SoC test system, the HA1200 die-level handler with unique active thermal control technology, and the T5801 Ultra-High-Speed DRAM test system, engineered to support the latest advancements in high-speed memory technologies – including GDDR7, LPDDR6, and DDR6. – SiConic, a scalable solution for automated silicon validation. Designed to address the increasing complexity of advanced systems-on-chip (SoCs), SiConic enables design verification (DV) and silicon validation (SV) engineers to achieve faster sign-off with unparalleled reliability, efficiency and collaboration.
- Advantest’s System-Level Test platforms that achieve cost-effective structural test coverage (SCAN, MBIST, LBIST, etc.) over functional high-speed IO interface with a wide range of Active Thermal Control options, including the new 7038 Single Test Rack (STR) that offers system-level and burn-in solutions at a lower cost and smaller footprint ideal for devices with higher power and larger package sizes.
- Extending the V93000 test system’s capabilities to support high-volume production of silicon photonics and co-packaged optics devices via a partnership with FormFactor.
- ACS Real-Time Data Infrastructure (ACS RTDI), a solution platform that automates the process of converting insights into actionable production steps within the same test insertion in milliseconds, optimizing yield, improving quality and reducing time to market.
In addition, the company participated in this year’s Test Vision Symposium, delivering multiple presentations on a myriad of relevant topics, including advanced packaging, data analytics, the utilization of AI/ML in test, co-packaged optics and silicon photonics.
