At Productronica India 2026 (Bangalore International Exhibition Centre, Booth C35), KYZEN will present two cleaning chemistries targeting electronics assembly process steps. KYZEN E5631 is formulated for spray-in-air, understencil, and ultrasonic systems to remove raw solder paste flux from stencils and A-side misprints; it operates at low concentrations and ambient temperatures and is compatible with stencil foil, epoxy adhesives, frames, and mesh. KYZEN E5325M targets offline maintenance cleaning of pallets, wave solder fingers, reflow oven parts, and associated tooling, with no VOCs and compatibility with aluminium, copper, and steel substrates.
KYZEN will also formally introduce Kanhu Panda in a regional role at the show. Partner companies Ecopmin Technologies (Hall 4, Booth E31) and iNETest (Hall 4, Booth C01) will exhibit alongside KYZEN at the event. KYZEN, with over 35 years in cleaning chemistry development, positions both products as process-ready solutions covering stencil-print and post-assembly maintenance stages.
Quelle: SMTA – https://smta.org/news/734603/KYZEN-to-Highlight-Stencil-and-Maintenance-Cleaning-Chemistries-and-Officially-Introduce-Kanhu-Panda.htm
