MICRONOX MX2123 is an aqueous, multi-phase chemistry meticulously crafted to eliminate flux residues from various IGBT module devices employing a combination of copper, silver and nickel DBC substrates, alongside PCBs. With its precisely balanced formula, MX2123 ensures exceptional surface conditions for subsequent wire bonding and potting processes, while safeguarding base metals with its retention of anti-oxidation materials like Organic Solderability Preservative (OSP) post-cleaning.
Renowned for its effectiveness at low temperature and concentration levels, MX2123 can be effortlessly monitored in both in-line SIA cleaning systems and Ultrasonic Immersion cleaning systems.
PCIM Europe, Stand 5.100
