At IMAPS Symposium 2026 (Booth 426, Encore Boston Harbor, Everett, MA, September 28–October 1), KYZEN will present three MICRONOX-series cleaning chemistries targeting demanding semiconductor and advanced packaging cleaning challenges. The line-up comprises the award-winning MICRONOX MX2123 for IGBT module flux residue removal, MICRONOX MX2708 for organic acid residues in advanced leadless packaging, and MICRONOX MX2127 positioned as an IGBT Module Cleaner.
MX2123 is a multi-phase chemistry suited for copper, silver and nickel DBC substrates, effective at low temperatures and concentrations in in-line spray-in-air or ultrasonic immersion systems. MX2708 addresses low-standoff gap penetration in Cu pillar flip chips, 2.5D/3D ICs, SiPs and AiPs, and is formulated to be non-corrosive to exposed metals and intermetallic alloys. Both chemistries are designed to maintain process efficiency while preserving sensitive metal surfaces, according to KYZEN.
Quelle: SMTA – https://smta.org/news/734973/MICRONOX-Chemistries-to-Be-KYZEN-Featured-Products-at-IMAPS-Symposium-2026.htm
