KYZEN’s Micronox products boast an impressive lineup of cleaning chemistries for defluxing and particulate removal. They provide effective cleaning solutions for advanced and power electronics and KYZEN recognizes the critical drivers for demand in advanced packaging: high yields and a product’s reliability throughout its lifespan.
Micronox chemistries are proven to successfully remove a variety of ionic flux residues and provided excellent cleaning performance on low standoff gap height devices. They are also highly compatible with sensitive metals and can improve post-soldering quality.
Whether the cleaning challenge is a chip scale package, flip chip package, wafer level CSP, system in package or 3-dimensional package, KYZEN and it’s 35 years of continuous innovation are prepared to clean devices and ensure their lifelong reliability.
