Kurtz Ersa has announced its participation in IPC APEX EXPO 2025, which is set to take place from March 15-20 at the Anaheim Convention Center in California. Attendees are encouraged to visit the leading supplier of electronics production equipment at Booth 824, where they will have the opportunity to experience the latest advancements in soldering and rework technology, including the VERSAFLOW ONE FF, VERSAFLOW ONE XF, VERSAFLOW 4/VERSAFLEX and the HR 600P Rework System.
VERSAFLOW ONE FF for selective soldering
The VERSAFLOW ONE FF offers high performance inline selective soldering for high-end production environments. Engineered for maximum throughput and modularity, it increases production capacity while maintaining flexibility. Key features include an intuitive operating system and proven control systems that ensure the highest level of process reliability.
VERSAFLOW ONE XF advances inline soldering
The VERSAFLOW ONE XF introduces groundbreaking advancements in compact inline selective soldering. With its dual-pot soldering module, the system is capable of simultaneous soldering on two assemblies within a PCB panel, increasing productivity by up to 50%. Unique X-variability technology enables soldering joints of varying sizes using different nozzle diameters, all without halting production. The ability to operate up to two soldering modules further enhances throughput, economic efficiency and soldering quality.
VERSAFLOW 4 featuring VERSAFLEX
The VERSAFLOW 4 featuring the VERSAFLEX Soldering Module provides flexibility for soldering processes. Designed for mixed production, the module eliminates downtime by automating mechanical adjustments and optimizing cycle times with CAD-Assistant 4.
HR 600P with Scavenger Technology
Finally, the HR 600P Rework System sets a new benchmark with its automated residual solder removal module (SC 600 Scavenger), which removes solder from PCBs without mechanical contact, ensuring precision and preventing damage. Its hybrid heating head combines infrared and convection heating for uniform thermal control, supported by a closed-loop temperature system and high-precision axis movements.
Designed for components ranging from 1 x 1 mm to 60 x 60 mm, the HR 600P supports applications for both large BGAs and miniature components, with advanced tools like the Ersa Dip&Print Station for precise flux or solder paste application.
At Kurtz Ersa’s booth, attendees will have the opportunity to witness live demonstrations of these solutions and discover how the company’s innovative technologies can optimize production efficiency, enhance reliability, and reduce operational costs. For more information, visit www.ersa.com.
