At Booth 947, Koh Young will demonstrate three systems targeting distinct process stages: the Meister S+ for micro solder and flux deposition inspection, the Meister D+ for advanced die inspection, and ZenStar for wafer-level applications. The lineup reflects the fragmented nature of advanced packaging, where SiP, flip-chip BGA/CSP, fan-out, panel-level and heterogeneous integration architectures each impose different dimensional measurement requirements.
The Meister S+ applies high-resolution optics and True3D measurement algorithms to characterise micro-scale solder and flux deposits ahead of subsequent assembly steps, addressing challenges such as highly reflective surfaces, substrate warpage and finer feature geometries that strain conventional 2D optical inspection. Koh Young positions the portfolio as scalable across resolution, optics and material-handling configurations to match individual process windows rather than offering a single fixed solution.
Quelle: SMTA – https://smta.org/news/734970/Koh-Young-Brings-Advanced-Packaging-Inspection-and-Metrology-Solutions-to-SEMICON-West-2026.htm
