“We are honored to continue the partnership with Bosch, one of our most prestigious customers who value the technology leadership to continuously improve the end customer experience and benefits. Koh Young believes the uncompromised full 3D measurement of solder paste is the only solution to realize real-time printing process optimization, by providing the accurate and reliable process information to begin with. We will continue to provide Bosch with the most advanced process optimization solution by 3D SPI systems, for its cutting-edge manufacturing environment.” said Dr. Kwangill Koh, the CEO of Koh Young Technology.
The most advanced SPI software solution embedded in the aSPIre 3 system provides simplified job management through SPI Library Manager, multi-lines production status review at a glance and via remote access by Multi-line Monitoring Tool and RMS, and even a real-time results traceability from SPI to AOI through KsmartLink, and much more.
“Koh Young’s Full 3D SPI systems have greatly contributed in ensuring a high level of quality for our customers. Its strong and dedicated global support organization has also been a great value to our worldwide production facilities. We look forward to more fruitful partnership in coming years with both companies’ technology leadership continued.” said Juliane Kueffner, the Competence Network Leader for solder paste inspection of Bosch Automotive Electronics.
