The company says it supports the European Union’s goal to reclaim 20 percent of global semiconductor manufacturing capacity by 2030 and is investing in a global semiconductor supply chain that is resilient and geographically balanced.
“Intel’s planned investment in Poland, combined with its existing wafer fabrication facility in Leixlip, Ireland, and its planned wafer fabrication facility in Magdeburg, Germany, will help create a first-of-its-kind end-to-end leading-edge semiconductor manufacturing value chain in Europe,” the company said in a press release. “It will also serve as a catalyst for additional ecosystem investments and innovation in Poland and across the European Union.”
“Poland is already home to Intel operations and is well positioned to work with Intel sites in Germany and Ireland. It is also very cost-competitive with other manufacturing locations globally and offers a great talent base that we are excited to help to grow,” said Intel CEO Pat Gelsinger. “We’re grateful for the support from Poland as we work to grow the local semiconductor ecosystem and contribute to the EU’s goal of creating a more resilient and sustainable semiconductor supply chain.”
“We are pleased that the largest greenfield investment in the history of Poland is being led by Intel, a Silicon Valley legend known for its innovation,” said Mateusz Morawiecki, prime minister of Poland. “Chips and semiconductors are critical technologies in the 21st century and we are excited to expand Poland’s role in the global semiconductor supply chain and help to establish the country as an economic trendsetter.”
A pan-European semiconductor ecosystem
The company says it chose Poland as the location for the new site for several reasons, including its infrastructure, strong talent base and excellent business environment. The new site is also well positioned to work with Intel’s leading-edge wafer fabrication site planned for Germany and its existing leading-edge wafer fabrication site in Ireland. This proximity will enable close collaboration between the three manufacturing sites and help increase resilience and cost efficiency of the European semiconductor supply chain.
“Wafer fabrication facilities (also known as “fabs”) create chips on silicon wafers through various advanced chemical, mechanical and optical processes. Assembly and test facilities, such as the one planned near Wrocław, receive completed wafers from fabs, cut them into individual chips, assemble them into final products and test them for performance and quality. The finished chips are then shipped to customers. In addition to completed wafers, the facility will also be able to accept individual chips and assemble them into final products. The facility will be able to accept wafers and chips from Intel, Intel Foundry Services or other foundries.”
