Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Semiconductor-packaging/Artikel
    Infineon and Semikron Danfoss sign supply agreement for electromobility chips
    Bildquelle nicht angegeben
    Semiconductor-packaging

    Infineon and Semikron Danfoss sign supply agreement for electromobility chips

    Infineon Technologies and German manufacturer of power semiconductor components Semikron Danfoss have signed a multi-year volume agreement for the supply
    Veröffentlicht
    04. August 2023
    Lesezeit
    1 Minute
    Rubrik
    Semiconductor-packaging

    “Our IGBTs and diodes play a major role in the industry’s electromobility transformation by enabling efficient power conversion in the electric powertrain,” said Peter Schiefer, President of Infineon’s Automotive division. “Our broad product portfolio, system expertise and continuous investment in our manufacturing capabilities make us a valued partner of automotive players like Semikron Danfoss.”

    “Semikron Danfoss provides automotive customers with power modules based on the most advanced assembly technologies that fully exploit the capabilities of IGBTs and diodes to enable further decarbonization of the transportation sector,” Claus A. Petersen, President of Semikron Danfoss added. “Automotive customers trust us as an experienced long-term partner to drive the transformation in the industry.”

    The IGBTs and diodes will be manufactured by Infineon at its sites in Dresden, Germany, and Kulim, Malaysia. Semikron Danfoss manufactures its own automotive power modules in Nuremberg and Flensburg in Germany, in Utica, US, and as of next year, in Nanjing, China.

    Mehr aus Semiconductor-packaging

    Weitere aktuelle Artikel aus der Rubrik Semiconductor-packaging.

    Alle Semiconductor-packaging-Artikel
    Nanoscribe Expands Photoresin Portfolio for Micro-Optics Fabrication via Two-Photon PolymerizationFoto: Brecht Corbeel / Unsplash
    Semiconductor-packaging

    Nanoscribe Expands Photoresin Portfolio for Micro-Optics Fabrication via Two-Photon Polymerization

    11. November 2026

    Nanoscribe has detailed its range of photoresins engineered for Two-Photon Polymerization (2PP) and Two-Photon Grayscale Lithography (2GL), targeting high-precision micro-optics manufacturing on silicon, glass, and…

    Canon Launches FPA-6400ES6a KrF Lithography System with 400 Wafers-per-Hour ThroughputFoto: Canon Europe (semicon)
    Semiconductor-packaging

    Canon Launches FPA-6400ES6a KrF Lithography System with 400 Wafers-per-Hour Throughput

    10. November 2026

    Canon has announced the FPA-6400ES6a KrF scanner for semiconductor lithography, combining a throughput of 400 wafers per hour with industry-leading overlay accuracy of 4.0 nm and the ability to handle wafer warpage of…

    Fabmatics absorbs SCI business activities under unified brandFoto: Ludovico Ceroseis / Unsplash
    Semiconductor-packaging

    Fabmatics absorbs SCI business activities under unified brand

    6. November 2026

    Fabmatics has integrated the business activities of SCI under the Fabmatics brand, consolidating the acquired expertise within its semiconductor automation portfolio.

    Entegris and Kioxia Expand Partnership on Materials Innovation for Next-Gen 3D Flash MemoryFoto: Louis Reed / Unsplash
    Semiconductor-packaging

    Entegris and Kioxia Expand Partnership on Materials Innovation for Next-Gen 3D Flash Memory

    6. November 2026

    Entegris and Kioxia are deepening their strategic partnership to co-develop materials and process technologies for future BiCS FLASH 3D NAND architectures, using AI, digital-twin modelling and experimental validation at…

    ← Zurück zu Semiconductor-packagingZur Startseite