- Extra design cycles, caused by poor testability and/or manufacturability, often involving multiple layout spins and prototyping runs
- Long prototype debug intervals, caused in part by the presence of manufacturing faults obscuring design issues
- Logistical difficulties with pre-programmed devices, such as wrong or out-of-date configurations being placed on PCBs
- and causing assembly delays
- Problems in manufacturing fault clearing caused by poor test diagnostics and/or wrong documentation
- Oversized bone-pile at functional test and excessive time expended in PCB troubleshooting, due to prevalence of defective boards making it through structural testing,.
- Mystery failures in HASS or HALT environmental tests, e.g. failures at temperature that disappear at room temperature
- Lengthy repair times due to poor test capability in the support facilities
- Boundary-scan can help resolve many of the issues discussed above. Furthermore, significant economic opportunities and quality improvements accompany these benefits. The technology is particularly effective if it is implemented corporately as a fundamental part of the test strategy.
- Boundary-scan for manufacturing faults, typically caused by soldering problems
- Functional testing for at-speed problems, faults that are manifested at operating range limits, user-generated errors, etc., in other words the types of faults anticipated in actual use
- Reduction in process steps and simplified product flow
- One-stop for structural and functional testing, and in-system programming
- Saving of factory floor space
- Reduced training requirements for test personnel with a uniform user interface
