Saki Corporation, an innovator in the field of automated optical and x-ray inspection systems, introduced its 3Di Automated Optical Inspection systems at productronica. The system delivers high-speed (5,700mm 2/sec), high-accuracy (XY positioning of 3 μm at 3Õ), height repeatability (below 2 μm at 3Õ), and scalable resolutions of 7, 12 and 18 μm for boards weighing 12kg.
It is a key component of the 3Di-LS2, 3Di-LD2, and 3Di-ZS2 hardware platforms. A dual-motor drive system, linear scale, and full closed-loop functionality provide machine accuracy and repeatability to generate absolute measurement data, which is essential for accurate machine-2-machine (M2M) communication. The company’s CoaXPress interface in the overhead camera captures images 1.7 times faster than previous models.
The 3D SPI (Solder Paste Inspection ) systems, the 3Si-LS2, 3Si-LD2, and 3Si-7µm, were also on display. One common software platform supports all 3D inspection systems – solder paste, optical, and x-ray–with an easy-to-program, intuitive software wizard. Auto-programming software significantly reduces library creation time, as libraries are automatically created using Gerber and CAD data. Algorithm-based software provides extensive programming capabilities, even for non-programmers. The company’s inspection data and default thresholds adhere to IPC standards.
The concept, Quality Driven Production, or QDP, was also introduced, as a set of tools that ensures that the data and information that is communicated to third party systems is valid and accurate. It improves the stability of the process, while at the same time it increases productivity and minimizes the operating cost of the equipment. A self-diagnostic system with predictive and preventive maintenance management assures stable machine conditions and repeatable, consistent performance. Every key component is monitored along with system conditions, and a detailed diagnostic log is recorded. An optimized preventive maintenance plan reduces maintenance time, machine down-time, manpower, and costs.
The Multi Process View (MPV) on the BF2-Monitor shows the results of all inspection processes (SPI, pre-reflow, and post reflow) on one screen in real time for operator review, simplifying the verification process and making it less subject to error. It is also useful for analyzing the cause of a defective board.
