Hesse Mechatronics partners with CAD Design Software

Multiple bond wire groups can be set with unique references.
Sequence numbers and direction arrows will be visible in the drawing.
Create individual bond wire reference blocks.
Update existing blocked entities such as the dies or chips with reference points that will be included in the XML output.
Assign a name for the Bond Wire Reference (BDS) for selected wires.
Assign the Reference a Sequence Number (BDR), which controls the order in which each will appear in the exported XML file.
Assign a parent name (DEPENDON) to use as a reference system.
Set a symbol text (REFP1, REFP2) to be used as a first and second reference point.
Add direction arrows and sequence numbers to the drawing and set size of text and arrow size.
An array of wirebond data can be exported when an array of identical parts is being wirebonded.

Multiple bond wire groups can be set with unique references.
Sequence numbers and direction arrows will be visible in the drawing.
Create individual bond wire reference blocks.
Update existing blocked entities such as the dies or chips with reference points that will be included in the XML output.
Assign a name for the Bond Wire Reference (BDS) for selected wires.
Assign the Reference a Sequence Number (BDR), which controls the order in which each will appear in the exported XML file.
Assign a parent name (DEPENDON) to use as a reference system.
Set a symbol text (REFP1, REFP2) to be used as a first and second reference point.
Add direction arrows and sequence numbers to the drawing and set size of text and arrow size.
An array of wirebond data can be exported when an array of identical parts is being wirebonded.

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