Among the highlights at PCIM will be the debut of DTS Silver, a next-generation Die Top System material designed for high-performance applications at an optimized cost. The Heraeus Die Top System (DTS) enables copper wire on sintered power semiconductors, delivering exceptional flexibility. DTS enhances electrical and thermal conductivity, strengthens die connection reliability, and optimizes overall module performance. The innovative solution DTS Silver is free of palladium and gold, offering a cost-efficient yet highly reliable alternative for power electronics manufacturers.
Heraeus Electronics will also showcase Condura.ultra, a silver-free AMB bonding technology for metal-ceramic substrates. Designed for high-end applications and with a low total cost of ownership Condura.ultra maintains outstanding reliability. It enables the use of thicker copper layers while allowing thinner ceramics, maintaining equal thermal resistance compared to traditional AlN substrates. With high thermal conductivity (80 W/m∙K), this innovative material is ideal for sintering, bonding, and soldering processes, offering exceptional performance.
Experts from Heraeus will deliver two insightful presentations at the e-Mobility & Energy Storage Stage (Hall 6, Booth 220), providing in-depth insights into cutting-edge materials for power electronics:
- “Heraeus Electronics Introduces the Next Generation DTS” – speaker: Christian Kersting; May 6, 12:30 PM
- “Ag-Free Silicon Nitride AMB Substrates for Automotive Power Module Applications” – speaker: Oliver Mathieu; May 7, 12:55 PM
The company will also host several live product presentations at its booth, showcasing the latest advancements in power electronics materials.
- DTS Silver – The innovative solution for cost-optimized, high-performance applications Live presentation: May 7, 14:00 PM and May 8, 11:00 AM
- Condura.ultra – A cost-effective, silver-free Silicon Nitride AMB for demanding applications: Live presentation: May 6, 11:00 AM and May 8th, 13:00 PM
- mAgic PE360 – Pressure silver sinter paste for module attach applications Live presentation: May 6, 14:00 PM
- Fastlane – An EU-funded project accelerating the European value chain for power electronics: Live presentation: May 7, 11:00 AM
Visit the company‘s website to confirm the presentation details.
