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    Startseite/Semiconductor-packaging/Artikel
    Global Semiconductor Equipment Billings Hit Record $40.53 Billion in Q2 2026
    Foto: Harrison Broadbent / Unsplash
    Semiconductor-packaging

    Global Semiconductor Equipment Billings Hit Record $40.53 Billion in Q2 2026

    SEMI reports 23% year-over-year growth driven by AI infrastructure investment
    Veröffentlicht
    09. September 2026
    Lesezeit
    1 Minute
    Rubrik
    Semiconductor-packaging

    SEMI has reported that global semiconductor equipment billings reached US$40.53 billion in the second quarter of 2026, representing a 23% increase year-over-year and 11% quarter-over-quarter growth. The results, compiled from data submitted by SEMI and the Semiconductor Equipment Association of Japan (SEAJ), mark back-to-back record quarters for the industry.

    SEMI President and CEO Ajit Manocha attributed the sustained growth to accelerating demand for advanced manufacturing capacity supporting AI chip production and global AI computing infrastructure buildout. Growth was recorded across Asia, North America, and Europe. The figures encompass more than 22 market segments tracked in SEMI's WWSEMS report, which covers front-end and back-end semiconductor equipment relevant to advanced packaging and chip manufacturing supply chains serving the electronics industry.

    Quelle: SEMICON Europa – https://www.semi.org/en/semi-press-release/global-semiconductor-equipment-billings-increased-23-percent-year-over-year-in-q2-2026-semi-reports

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