According to SEMI's latest 300mm Fab Outlook, released at SEMICON West in San Francisco, global front-end fab equipment spending is forecast to grow 31% year-over-year to $149 billion in 2026, with double-digit growth rates continuing through 2029. Fab construction spending is projected to rise 23% to $47.5 billion in 2026 and a further 33% to $63.3 billion in 2027, reflecting sustained capacity expansion across leading-edge logic, memory and other 300mm semiconductor technologies.
SEMI projects 20 new 300mm fabs or production lines to begin construction worldwide in 2026 and 18 in 2027, excluding pure R&D facilities. Equipment investment in the Americas is expected to more than double from $18.1 billion in 2026 to $40.6 billion in 2029 as the regional manufacturing footprint expands significantly.
For European electronics manufacturers and their supply chains, this trajectory signals continued demand pressure on advanced packaging, substrate materials and back-end assembly equipment as additional fab capacity transitions from construction into high-volume production over the forecast period.
Quelle: SEMICON Europa – https://www.semi.org/en/semi-press-release/global-300mm-fab-equipment-spending-to-reach-227-billion-in-2029-as-buildout-accelerates-semi-projects
