The Orcomer hybrid polymer promises a photo-patternable (per lithography) material that consists of a silica-like network at the molecular level. It can be modified to specific applications by various precursor (alkosilanes) formulations. This spring, several spin-off firms of CSEM are to produce the first 2 x 2 monitor modules for VCSELs and fiber couplers. Suess is reported to have developed a special mask aligner for Orcomer materials. Another follow-up industrial cooperative including Bosch, Motorola, Thomson Detexis and Ericsson is developing Orcomer FR applications. Bosch has demonstrated a 3D-stacked patch antenna and a coplanar microstrip line transition. Ericsson, in conjunction with Swedish research institute ACREO, has shown a microprocessor MCM L/D design (BGA and bare die) on BT as well as on FR-4. Additionally, both companies have developed a 19 x 19mm transmitter MCM L/D with driver-chip array, VCSEL array and waveguide connector on SBU board with integrated waveguide in three dielectric layers of Orcomer. (ws)
