The new board reflects Eu-rope’s electronic packaging and interconnection industry as well as the various nationalities of the membership. Paul Waldner, managing director of Multiline, is now the chairman. The following individuals have also now joined the board: Wil Kregting, Viasystems, Netherlands (vice chairman); Brewster Barclay, Orbotech, Belgium (vice chairman); Michael Weinhold, Dupont, Switzerland (treasurer); Umberto Aiassa, ACD Technologies, Italy; Martin Goosey, Shipley, UK; Didier Mauve, Deglarges, France; Fabio Pelizzoli, Cabel, Italy; Andreas Steinkogler, Microser, Spain; Joachim Zimmermann, Bosch, Germany; William Burr; Lares Cozzi, Italy and Jules Limpens, Cimnet Systems, Germany.
Jo Warnier, executive director, outlined the EIPC activities. These initiatives are based on effective information distribution on a pan-European scale. Emphasis will be placed on: coherent database of statistics and market information for Europe in co-operation with sister associations; technology exchange through conferences, training courses, organization of the European PCB con-vention and ECWC9 world conference: supply of marketand technology-related publications such as IPC/WECC standards, market studies and focused membership information. The institute will continue an active role in the European Federation of Interconnection and Packaging (EFIP), to group the various national associations under a single umbrella, coordinating European contacts with other associations through the World Electronic Circuits Council (WECC). This activity adds value to Europe’s industry through international coordination of standards activity, joint positions on tariffs and trade, the environment and technology development.
Gerhard B. Wolski
