On Tuesday, May 6, the company’s Product Manager for ESM/Power Electronics, Joseph Hertline, will host a presentation titled: “Materials Technology for Flux-Free Soldering Applications in Power Electronics”. This e-Mobility session will spotlight flux-free soldering applications using the company’s Fluxless Assembly Solder Technology (FAST). The talk will outline best practices for flux-free reflow methodologies, including using novel solder paste technology to reduce process steps, cycle times, and improve efficiency in mass production.
Also on Tuesday, May 6, Andreas Karch, Regional Technical Manager and Technologist for Advanced Applications, will hold a presentation titled: “Reducing Effort in Secondary Processes of Power Module Manufacturing Through Adapted Solder Paste Systems.” The presentation will discuss how optimized solder pastes can minimize or eliminate the need for cleaning processes, aiming to thereby increase cost-efficiency of manufacturing modern power modules.
On Wednesday, May 7, Ryan Mayberry, Senior Applications Development Engineer for ESM, will host the presentation “Design Considerations for Soldering Material Selection in Power Module Package-Attach. The e-Mobility-focused session will discuss soldering material selection for power module package-attach in EV inverter systems.
Also on May 7, Ryan Mayberry will host a poster presentation titled “The Effect of Accelerated Aging on Solder Shear Strength for Package-Attach in Power Electronics,” focusing on the implementation of a fast, practical solder evaluation method for package- or module-attach applications in power electronics.
“Advancements in Formic Acid Soldering Materials Technology for Power Device Packaging,” will be the topic of a poster presentation delivered by Product Manager for semiconductors, Dean Payne. Exploring a novel flux-free solder paste technology for use in power discrete components and power modules, the presentation highlights how formic acid soldering enables ultra-low voiding, optimal RDS-on, and thermal performance.
Attendees at the expo can visit the company in hall 6 (Booth #358). Visit the company website to confirm details about the on-site presentations.
