The presentation, Solder as Known Good Interconnect (KGI) in Heterogeneous Integration, will explore how solder and low-melting metals and metal alloys have evolved over the past 50 years, as well as the challenges ahead for assembly processes and reliability as new devices drive new power, performance, volume, and cost requirements.
“Hybrid bonding or direct bonding remains of significant interest for any company creating advanced packaged and heterogeneous integrated devices. However, hybrid bonding will likely remain a post-back-end-of-line process within wafer and system foundries due to its sensitivity to particulates and specificities of CMP and surface conditioning,” said Dr. Mackie. He added: “For outsourced semiconductor assembly and test companies and others seeking a more simplified approach, solder and the reflow process remain the primary means of creating a known good interconnect.”
Dr. Mackie is an electronics industry expert specializing in the convergence of novel materials, emerging technologies, and potential business impact. His professional experience encompasses all aspects of materials and processes for electronics manufacturing from wafer fabrication to semiconductor assembly and packaging, as well as SMT/electronics assembly.
The presentation will take place on Thursday, July 3, from 8:30 to 10:10 a.m. Further details are available on the event website.
