As ‘Your Partner for Smart Factory Realization,’ Koh Young Technology showed how its true 3D solutions can improve production throughput and yield at the IPC Apex Expo that was held in San Diego, California. The company displayed an array of inspection systems with expanded capabilities.
Leveraging its core strengths in robotics and true 3D measurement, the company brought the next generation of accuracy to the pin inspection, machined parts, and semiconductor inspection markets. The KY-P3 delivers true 3D inspection data for single array, forked, press-fit, and other pin configurations for Final Optical Inspection (FOI) with applications like engine control units. The system also measures pin height, solder height, and pin tip separation with the highest accuracy and repeatability.
The latest Machining Optical Inspection (MOI) system was also appealing for visitors. Developed around its core 3D measurement technologies, the MOI system inspects metal case surfaces for scratches, cracks, and stains, along with height, diameter, volume, and more. Committed to bringing about “Smart Manufacturing” innovations, the system delivers both visual and process inspection simultaneously, which improves process yield and reduces false calls.
Beyond pin and machined part inspection capabilities, the latest Meister D solution focuses on the SiP (System-in-Package) assembly process. This machine improves production yields on high density modules comprised of bare die and passives by integrating defect analysis and metrology software. With small sized component inspection down to 008004 inch, the system overcomes challenges in semiconductor packaging, which are compounded by chip stacking and wafer thinning. What’s more, the system also allows machine learning-based crack inspection.
