BGA rework poses unique challenges, including limited joint visibility, increasing package complexity, and narrow thermal process windows. The new system will be used in the C1BGA course to support practical, process-oriented instruction.
John Vickers, Master IPC Trainer at A.R.T. commented: “We’ve enjoyed a longstanding relationship with PDR Rework, supporting excellence in BGA rework training. Access to the latest equipment allows us to deliver training that closely mirrors real production environments.”
Vickers continued: “BGA rework is often where otherwise stable assembly processes fail, as defects can remain hidden and rework windows are unforgiving. Training must go beyond machine operation to emphasise process discipline, thermal management, and informed decision-making at every stage. Through structured, hands-on instruction, delegates gain the skills necessary to perform reliable and repeatable rework.”
The C1BGA training course is a one-day, practical program dedicated to surface-mount BGA rework. The curriculum covers BGA package types, common rework challenges, controlled removal and cleaning, solder application, component placement, and inspection in accordance with IPC-A-610. The course also addresses multilayer PCB structures and appropriate tool selection.
