Koh Young’s product manager Alex Lim introduced the new model as reaction on the growing demands in Wafer-Level-Packaging applications. The average bump size of 70 µm will decrease to 50 µm in near future. To fulfil the future demands, Koh Young developed a new camera and lenses system. The camera is developed and build by Koh Young and optimized for high-speed image acquisition in a 24/7 production environment.
The new model will be presented on SMT Connect exhibition in Nuremberg. The Koh Young team is looking forward to your visit on our booth in Hall A4/233.
