September 2004: 07 – UK, Manchester; 09 – Ireland, Limerick; 14 – Portugal, Porto; 15 – Spain, Terrassa; 16 – France, Rennes; 21 – Hungary, Szekesfehervar; 22 – Austria, Vienna; 23 – Slovenia, Kranj; 28 – Germany, Hannover; 29 – Germany, Würzburg; 30 – Switzerland, Zürich.
October 2004: 11 – Italy, Padova; 12 – Italy, Bergamo; 13 – Italy, Fiuggi; 14 – France, Archamps; 19 – Poland, Gdansk; 20 – Denmark, Arhus; 21 – Sweden, Stockholm; 26 – Finland, Espoo; 28/29 – Benelux, Oosterhout.
November 2004: 02 – Turkey, Istanbul, and 04 – Czech Republic, Brno.
Following highlights will be covered: backward/forward compatibility in lead-free processing, effect of cooling rate on solder joint structure, compatibility of equipment materials with alloys, case studies illustrating challenges, pitfalls, and success stories drawn from real life. Also included are: lead-free wave soldering, selective soldering, high-speed lead-free reflow, etc., and an interactive session.
