Ersa‘s EXOS 10/26 is a convection reflow soldering system with 22 heating and 4 cooling zones as well as a vacuum chamber after the peak zone, to remove voids in the solder contact areas between component and PCB surfaces. In addition to its extraordinary process reliability, the system impresses with its extreme ease of maintenance.
The Ersa Versaeye module enables the optimal documentation of solder joint quality on the basis of your individual quality requirements. Incorporating it into the company’s Versaflow selective soldering systems, the Versaeye is optimized for the inspection of THT solder joints. Through the use of up to nine cameras, it can detect different wetting problems, solder bridges, solder balls or missed out pins.
With the Ersa HR 600 XL it is possible to professionally rework BTC components on big board assemblies. Boasting a heated area of 24 x 24 “ and a PCB thickness of up to 10 mm opens up rework capabilities in the segments of telecommunication, network and infrastructure. The high precision repair process is ideal for desoldering, placement and soldering of all types of surface mounted devices (SMD): BGA, metallic BGA, CGA, BGA socket, QFP, PLCC, MLF, etc.