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    Startseite/Semiconductor-packaging/Artikel
    Entegris wins CMP slurry patent disputes in Taiwan and China
    Foto: Infralist.com / Unsplash
    Semiconductor-packaging

    Entegris wins CMP slurry patent disputes in Taiwan and China

    Courts uphold colloidal silica patents against Qnity challenges, reinforcing IP portfolio for semiconductor CMP applications
    Veröffentlicht
    27. Oktober 2026
    Lesezeit
    1 Minute
    Rubrik
    Semiconductor-packaging

    Entegris announced that Taiwan's Intellectual Property and Commercial Court on 14 July 2026 upheld Taiwan Patent No. I561622, and China's National Intellectual Property Administration on 10 August 2026 upheld Chinese Patent No. 107075343B — both relating to acidic colloidal silica slurry technology used in CMP processes. Both decisions rejected invalidation challenges filed by an affiliate of Qnity Electronics, Inc.

    The rulings extend a series of enforcement successes for Entegris involving the same patent family. In 2021, the U.S. International Trade Commission found that Qnity's Optiplane CMP slurry products infringed U.S. Patent No. 9,499,721 and issued exclusion and cease-and-desist orders. A 2024 U.S. district court resolution maintained those orders, which remain in force until 2035.

    CMP slurries are critical consumables in advanced semiconductor front-end manufacturing, used to planarize wafer surfaces between process layers. Entegris, headquartered in Billerica, Massachusetts, supplies materials and process solutions across the semiconductor manufacturing chain.

    Quelle: Entegris (semicon) – https://investor.entegris.com/news/news-details/2026/Entegris-Achieves-Further-Success-in-Defending-Its-CMP-Slurry-Patent-Portfolio/default.aspx

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