Entegris has announced three concurrent moves to enter the thermal management materials segment for AI advanced packaging. The Billerica, Mass.-based company has completed its acquisition of Advanced Abrasives Corporation, a New Jersey specialty producer of diamond-based precision super-abrasive consumables used in hard-substrate polishing. The deal extends Entegris' existing silicon carbide CMP portfolio — covering slurries, pads, cleans and surface conditioning — and adds diamond material expertise relevant to chip- and package-level heat dissipation.
Following customer engagement, Entegris plans to establish a new manufacturing line in Taiwan to commercialise these SiC solutions, while maintaining U.S.-based R&D for next-generation thermal interface materials. In parallel, the company has entered a long-term development partnership with Element Six, the De Beers Group subsidiary and global leader in synthetic diamond, to accelerate integration of diamond-enabled thermal management into wafer-level and heterogeneous advanced packaging.
For the European electronics manufacturing supply chain, the moves signal growing supplier investment in thermal interface and CMP materials driven by AI compute density requirements — an area of increasing relevance to advanced packaging subcontractors and EMS providers working with high-power chiplet architectures.
Quelle: Entegris (semicon) – https://investor.entegris.com/news/news-details/2026/Entegris-Enters-Silicon-Carbide-and-Diamond-Enabled-Thermal-Management-Materials-Market-for-AI-Advanced-Packaging/default.aspx
