With the ability to run up to 3 processes on a single platform, manufacturers benefit from simplified production lines, and a faster return on investment.
Performance without compromise
At the heart of the Tarantula Dual Lane lies the company’s next-generation control and motion technology. With Jet-on-the-Fly, the system achieves up to 1.1 million dots per hour at maximum frequency, and an average of 350,000 dots per hour for complex boards in high-speed solder paste jetting. For glue jetting applications, it reaches a maximum frequency of 2 million dots per hour.
The platform supports up to three valves in parallel, offering full process flexibility—from solder paste to glue and epoxy jetting, thermal paste dispensing, or dam and fill applications. Whether used for fine-pitch solder paste deposits or staking, the Tarantula Dual Lane adapts precisely to production requirements.
Versatility, quality, precision, and traceability
Along with other Essemtec dispensing platforms, the Tarantula Dual Lane is capable of jetting or dispensing almost any material used in modern electronic manufacturing and beyond. Typical applications include dam and fill, 3D dispensing, jetting in cavities, staking, silver epoxy dispensing, shielding, microcoating, dielectric ink, liquid metal, thermal paste, and edge bonding.
It supports a wide board size range from 50 × 50 mm up to 560 × 500 mm, or identical board size up to 560 × 275 mm—offering true versatility for any production environment.
Concerning quality and consistency, the platform ensures exceptional results by combining both non-contact jetting and contact dispensing within a single system. Optional 2D Solder Paste Inspection (SPI) with automatic correction enables continuous monitoring and optimization, and integrated traceability features guarantee complete control of materials and process parameters throughout production.
Efficiency meets sustainability
The Tarantula Dual Lane supports a more sustainable production model. By jetting only the exact amount of material required, it eliminates stencil cleaning chemicals and reduces material waste. A single system performing multiple processes means fewer machines on the line—resulting in lower energy consumption, reduced floor space, and a smaller environmental footprint.
Ease of use and upgradability
Powered by the company‘s ePlace software and Optimizer tool, the platform is intuitive, fast to set up, and easy to learn to use. Furthermore, as with all Essemtec systems, the Tarantula Dual Lane is fully upgradable. Software updates, new valve technologies, and additional features can be added at any time, protecting investment and ensuring long-term adaptability.
The dual-lane concept is now also available for the Puma Ultra, Essemtec’s latest high-speed Pick-and-Place platform. This expansion enables manufacturers to benefit from dual-lane productivity across both dispensing and assembly, unlocking new levels of efficiency for high-volume SMT production. Compatibility with EasyLogix PCB-Investigator ensures a seamless transition from PCB design to production, unifying the process flow across Essemtec’s adaptive equipment ecosystem.
Experience it live at productronica
Industry professionals can experience the new platform in action at productronica 2025, at Booth A3.261. The company invites attendees to visit the booth to discover how it continues to push the boundaries of speed, precision, and sustainability in electronics manufacturing.
