The Cookson Electronics’ Camalot XyflexPro DLM (dual-lane multitasking) dispensing system minimizes head idle time by processing products in the opposite lane while dispensed material flows under the die. Unlike most competitive systems, both wait time and break time functionality is maintained, keeping product quality at a maximum. This functionality can increase throughput by as much as 80% over single lane systems. On the contrary, traditional multi-pass underfill applications can waste a significant amount of time waiting for capillary flow of material under the die, part transport, and pre-heating of parts before a second or third pass can be processed. The machine features two independently controlled conveyors, which asynchronously transport parts through the platform, effectively eliminating transport and pre-heat bottlenecks from the production line. The DLM dual dispense head capability, combined with the ability to handle three zones of heat per lane, provide the flexibility to provide encapsulation, dam & fill, epoxies or other hybrid applications. The XyflexPro system is distinguished by its calibration-free, linear gantry drive system, reduced footprint, and ability to meet any application at both SMT and semiconductor production through easy-to-add options.
