- Use under-board support
- Establish an optimum nozzle-to-PCB distance and use it consistently.
- Inspect underside solder joints in the vicinity of the reworked component.
- Ensure that rework equipment is able to support the higher temperatures and tighter process control when working with lead-free finishes.
- Ensure that operators are fully trained, and understand the changes in material properties and process demands for successful rework of lead-free assemblies.
