ClassOne Technology offers its Solstice Wet Etch Chamber for under-bump metallization (UBM) processing in wafer-level packaging and flip-chip applications. The system handles patterned metal etching following plating and photoresist strip steps, targeting gold and titanium etch with zero undercut as a key process outcome. Cross-wafer uniformity is achieved through a flood-flow spray mechanism combined with precision RPM control.
The Solstice platform is available in two configurations: the Solstice Max supporting 200 mm and 300 mm wafers, and the Solstice S-Series for substrates up to 200 mm. Standard end-point detection is included for patterned metal etch applications to control critical dimension loss and minimise undercut. ClassOne positions the system on cost-of-ownership and throughput metrics relevant to advanced packaging production environments.
UBM wet etch is a critical process step in semiconductor packaging, directly affecting bump reliability and yield in flip-chip and wafer-level chip-scale package (WLCSP) production — areas of growing relevance to European OSATs and IDMs scaling advanced packaging capacity.
Quelle: Classone (semicon) – https://classone.com/technology/seed-and-barrier-etch/ubm-and-patterned-metal-wet-etch/
