The new adhesives utilize heat-activated EVA polymers to achieve a secure, temporary bond, ensuring wafer stability during high-precision fabrication steps. They are available in the following specialized formulations: Standard, ideal for general applications; Conductive, designed for applications requiring electrical conductivity; and High Temp, optimized for elevated temperature environments.
To meet various process requirements, these adhesives are offered in three distinct configurations: Release Paper, for tandard applications; single-Sided Mylar, ideal for cutting applications; and double-Sided Mylar, which provides additional substrate protection.
WaferGrip and TrueGrip are applied by heating the adhesive at 100°C–140°C with light pressure in a vacuum chamber for 30–60 seconds, ensuring precise and uniform bonding. The adhesives exhibit exceptional chemical resistance, standing up to IPA, acetone, and water, making them highly reliable for demanding semiconductor processes.
When it is time for removal, CE3S offers StripAid solvent, which efficiently dissolves the adhesive while maintaining wafer integrity. Additionally, these adhesives have an extended shelf life of 1.5 years under proper storage conditions (cool and dry environment).
“With the launch of Millice WaferGrip and TrueGrip, CE3S is delivering a highly adaptable and reliable solution for temporary wafer bonding,” commented Jeremy Wagner, President of CE3S. “These adhesives provide a combination of strong adhesion, easy removal, and superior chemical resistance, empowering semiconductor manufacturers to achieve greater efficiency and precision.”
