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    CE3S expands wafer dicing solutions portfolio
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    News

    CE3S expands wafer dicing solutions portfolio

    CE3S has launched with the wafer dicing solution KerfAid Series.
    Veröffentlicht
    27. Februar 2025
    Lesezeit
    2 Minuten
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    Cumberland Electronics Strategic Supply Solutions (CE3S), a distribution partner and provider of strategic sourcing and professional solutions, has expanded its product portfolio with the addition of the KerfAid Series. The series is an innovative wafer dicing solution designed to improve cutting performance, reduce defects, and enhance process control. 

    Through its strategic partnership with The Millice Group, CE3S continues to advance capabilities in precision manufacturing by addressing electrostatic discharge (ESD) challenges early in the dicing process, preventing latent failures that can impact downstream production. When paired with HiSpec injectors, KerfAid, optimizes lubrication, cleaning, and substrate protection, ensuring higher yields and superior quality for semiconductor and electronics manufacturers. 

    KerfAid is designed to work in tandem with the HiSpec XA1, HiSpec XI, and HiSpec XP injectors, which seamlessly integrate into all brands of existing dicing saws. These advanced injectors provide precise, consistent application of KerfAid, ensuring optimal process control and repeatability. With flexible configurations, each HiSpec injector can support between one and four or more saws, making them adaptable for a wide range of manufacturing operations. 

    KerfAid ‘000 Series: Maximum Protection & Performance

    The KerfAid ‘000 Series, featuring an integrated corrosion inhibitor, is specifically engineered to tackle wafer dicing challenges such as debris build-up, galvanic corrosion, and ESD mitigation. Its high-molecular-weight lubricant enhances blade longevity, extending its lifespan by up to 2X versus DI water, and up to 70% compared with leading competitors. Additionally, KerfAid has demonstrated a 90% increase in bond success rate over competitors and a reduction in chipping and cracking by up to 63% compared to DI water. 

    The key benefits include: 

    • Reduction in chipping and micro-cracking for precision dicing;
    • prevention of ESD, minimizing failure risks;
    • extension of blade life with advanced lubrication technology;
    • enhancement of bond success rates for improved manufacturing yield;
    • elimination of debris contamination, ensuring clean, bond-ready surfaces; and
    • controls corrosion to enhance long-term durability

    KerfAid ’00 Series: high-performance cleaning without corrosion inhibitor

    For applications that require superior lubrication and cleaning but do not require corrosion inhibitors, the KerfAid ’00 Series provides friction reduction and defect prevention with its proprietary triple-surfactant blend. This formula is optimized for LED and IC wafer processing, ensuring superior cooling efficiency and reduced heat-related damage.  

    The key benefits of KerfAid ’00 Series include: 

    • Reduction of defects, ensuring pristine dicing results;
    • enhanced blade cooling efficiency, minimizing heat-related damage;
    • superior suction capabilities for LED and IC wafers;
    • adjustable spring strength, optimizing material handling; and
    • smooth material release, preventing residue build-up.

    For more information on KerfAid and HiSpec injectors, or to learn how CE3S supports precision manufacturing, please visit www.ce3s.com.

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