Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/News/Artikel
    Call for participation in 2027 packaging conference
    Bildquelle nicht angegeben
    News

    Call for participation in 2027 packaging conference

    The call for participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration – taking place
    Veröffentlicht
    06. August 2026
    Lesezeit
    2 Minuten
    Rubrik
    News

    AEPC 2027 aims to bring together the brightest minds across the electronics ecosystem to share peer-reviewed technical content, practical solutions, and emerging technologies that are advancing the industry. The conference serves as a vital platform for exchanging innovations that span electronics design, materials, assembly and test, reliability, manufacturing, and system integration.

    The conference sessions will be held on April 5–7, 2027; the professional development courses will be held on April 4, 5, and 8, 2027; and posters will be available for viewing on the APEX EXPO show floor from April 6–8, 2027.

    Presenting at the event offers speakers a unique opportunity to showcase their work to a global audience of engineers, researchers, manufacturers, and technology decision-makers. Selected speakers gain industry recognition, valuable peer feedback, opportunities to build new professional connections, and the chance to influence the future direction of electronics packaging, manufacturing, and system integration.

    This year’s conference attracted more than 170 participants from 20 countries and featured 78 peer-reviewed technical papers representing over 100 companies, universities, and research organizations, demonstrating the conference’s role as a leading forum for technical exchange and industry collaboration.

    The association is calling for abstract proposals for:

    • technical presentations that demonstrate innovation, practical application, and measurable industry impact;
    • technical posters showcasing emerging research and applied solutions; and
    • professional development courses that advance the knowledge and skills of industry professionals.

    Submissions are encouraged across the full spectrum of electronics design, materials, assembly and test, reliability, manufacturing, and system integration.

    The deadline for submissions is September 18 for technical presentations and professional development courses; and December 4 for technical posters.

    Matt Kelly, Conference General Chair and CTO, VP, standards and technology solutions at the Global Electronics Association, commented: “AEPC 2027 offers an unparalleled opportunity to contribute to the advancement of electronics technology and manufacturing. We invite innovators from around the world to share their work and help shape the future of our industry.”

    www.apexexpo.org/event-info/call-participation

    Source: Loveleen Cherub/Pexels

    Mehr aus News

    Weitere aktuelle Artikel aus der Rubrik News.

    Alle News-Artikel
    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in GermanyFoto: Laurens van der Drift / Unsplash
    News

    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in Germany

    9. November 2026

    German distributor Microtronic has announced it will represent iRaptor LDA and its EYE thermal profiler in Germany. The Portuguese developer's system extends beyond conventional 2D time-temperature profiling by…

    Indium Corporation Presents Solder Materials Research at SMTAI 2026Foto: Indium Corporation
    News

    Indium Corporation Presents Solder Materials Research at SMTAI 2026

    29. Oktober 2026

    Indium Corporation is fielding five specialists at SMTA International 2026 to present new findings on solder paste rheology, BGA ball alloy selection for lower-temperature reflow, and the effect of print gap on paste…

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026Foto: Vishnu Mohanan / Unsplash
    News

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026

    16. Oktober 2026

    KYZEN will exhibit its AQUANOX line of aqueous electronics cleaning chemistries at SMTA International, October 27–29, 2026, highlighting prolonged bath life as a process efficiency and cost-reduction lever for…

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT LinesFoto: Cybord
    News

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT Lines

    29. August 2026

    Fuji America Corporation and Cybord have announced a strategic partnership to embed AI-powered component analytics directly into SMT production lines, enabling 100% real-time inspection of electronic components during…

    ← Zurück zu NewsZur Startseite