Merck is offering material solutions to the next generation automotive applications. Future automotive requires different features from current electronic devices, such as heat resistance, safety and long-lasting functionality chips. As materials plays a key role in the performance and reliability of advanced IC chips, the company is offering solutions in the semiconductor chip manufacturing and packaging to meet the needs of the automotive industry.
According to IHS Market’s Luca De Ambroggi during his presentation at Semicon West 2017, a high-end car will contain more than $6,000 worth of electronics in five years, driving a $160 billion automotive electronics market in 2022. Advanced IC chip packages, power systems, microcontrollers, sensors, camera, analog devices and application processes are driving the greatest adoption of semiconductor technology. Automotive has additional requirements additional requirements regarding redundancy and specific chip packaging, as well as minimum requirements for performance, reliability and operation for more than 10 years under harsh conditions (e.g., high temperature).
Electric vehicles and autonomous driving are key drivers for electronics’ continued growth in semiconductor sector, representing a new frontier for automotive electronic packaging and safety features. Future artificial intelligence platform applications will require ongoing collaboration with chipmakers and the automotive industry to understand their specific needs.
The automotive materials for the semiconductor chips include:
- Turnkey atomic layer deposition material for producing extremely powerful graphics chips, AI chips and processors Spinfil spin-on dielectric material offers an essential component for automotive memory chips.
- Innovative liquid-type photoresists for sensors and advanced packaging applications to achieve the narrowest and most conformal feature lines.
- Lead-free sintering paste material offering low interfacial resistance, high thermal conductivity and adaptive process techniques for power chips and system-in-package modules able to operate in very high temperatures.
