Exhibition highlights
The company will introduce new software, algorithms, and inspection capabilities combining True 3D measurement with AI and automation to enhance quality, efficiency, and process control. This will include:
- THT Inspection – New algorithms for Through-Hole and press-fit joints ensure reliable inspection in mixed-technology assemblies, reducing escapes and costly rework.
- KSMART – A data analytics platform that turns inspection results into actionable insights, enabling real-time optimization and continuous improvement toward the Smart Factory.
- KAP (Koh Young Auto-Programming) – AI-assisted auto-programming that generates optimized inspection programs automatically, reducing setup time from hours to minutes.
- Smart Review – An intelligent defect review system that filters false calls and highlights real defects, minimizing operator workload and accelerating corrective action.
- KY8030–3 – Equipped with a telecentric lens and 8-megapixel camera for sharper solder paste measurement and improved printing accuracy.
- Zenith 2 – Enhanced with side-view cameras that deliver more comprehensive inspection coverage, catching hidden or partially obscured defects that traditional AOI systems miss.
- Zenith UHS (Ultra High Speed) – Now capable of inspecting components up to 60 mm in height, supporting reliable quality control for tall devices used in EVs, power electronics, and data infrastructure.
Technologies on show
- KY8030–3 – High-speed True 3D Solder Paste Inspection (SPI) with new telecentric optics and 8 MP resolution, providing sharper images and more consistent solder paste quality.
- aSPIre3 – Maximum-precision True 3D SPI solution for fine-pitch and advanced designs.
- Zenith Alpha HS+ – High-speed True 3D Automated Optical Inspection (AOI) system balancing inspection speed and accuracy for high-volume SMT production.
- Zenith UHS – The fastest True 3D AOI platform, now supporting tall component inspection up to 60 mm, ideal for EV, power, and infrastructure applications.
- Zenith 2 – AOI platform with enhanced side-view cameras for comprehensive coverage, capable of detecting defects on hidden and partially obscured components.
- Neptune C+ – True 3D inspection of transparent and conformal coating materials using patented LIFT (Laser Interferometry for Fluid Tomography) technology.
- Meister D+ – Advanced semiconductor metrology system with sub-micron accuracy, designed for reflective and complex surfaces in advanced packaging.
Visit Koh Young
Industry professionals are invited to experience the company’s True 3D inspection, AI-driven software, and intelligent optimization tools in action. Its extensive showcase will be divided over the following Booths:
- A2.377 (Productronica – SMT & software)
- B1.213 (SEMICON Europa – advanced packaging & semiconductor)
