Plumbing the depths of reflow technology with the specialist books of Dr Hans Bell (Rehm Thermal Systems): in the wake of four successful volumes, the publication of the fifth marks the final part in the Rehm series „Reflow technology – Fundamentals of reflow soldering“. At the upcoming SMTconnect event, all those who are interested will have the opportunity to have their books signed by the authors Hans Bell, Günter Grossmann, Helmut Öttl and Martin Oppermann at the company’s booth.
„We shall see what we shall see“: It seems as if Carl Friedrich Gauß (1777–1855, German mathematician) had some sense of the disasters encountered on a daily basis when working with electronic assemblies when he said: „I already have the results, now I merely need to know how to arrive at them“. In this fifth volume of the series „Reflow technology – Fundamentals of reflow soldering“, entitled „Possibilities and limits in the analysis of solder joints“, Günter Grossmann, Martin Oppermann and Helmut Öttl explain many of the analytical processes and techniques used in the manufacture of electronic products in a brilliantly straightforward manner. It should help many to understand which tool is best suited to which application and, ultimately, the significance of analytical results.
The first four volumes of these handbooks on the topic of „Fundamentals of reflow soldering“, covering the subjects of „Fundamentals of materials technology in the field of soldering“, „Reflow soldering methods“, „Reliability and failure management“, „The consequences of continuous miniaturization“ as well as the new volume „Possibilities and limits in the analysis of solder joints“ (at first only in German) can also be ordered through the company.
SMTconnect, Booth 4A–100
