Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/News/Artikel
    Big-board printer features 24 x 36-in multi-panel capacity
    Bildquelle nicht angegeben
    News

    Big-board printer features 24 x 36-in multi-panel capacity

    Cookson Electronics' big-board version of its flagship MPM UltraFlex printer is capable of processing 24 x 36-in (600 x 900mm) boards that weigh up to 70
    Veröffentlicht
    01. Juni 2003
    Lesezeit
    1 Minute
    Rubrik
    News

    Cookson Electronics’ big-board version of its flagship MPM UltraFlex printer is capable of processing 24 x 36-in (600 x 900mm) boards that weigh up to 70 pounds (32kg). It can also handle smaller boards (4 x 6-in minimum), giving users the option to use the machine for more conventional requirements. Its heavy motorized construction and strengthened center-nest allow to handle heavy assemblies, three times the capacity of competitive systems. The machine has a proprietary 90-degree rotation mechanism, which allows the system to print large boards using standard, economically priced 29-in wide stencils. It also uses standard squeegee blades up to 24-in wide, even for the largest panels. The new version has the same footprint as the original UltraFlex and incorporates the features inherent in all these printers, including patented look-up/look-down vision, the fast 2D inspection system, and an automated vacuum stencil wiper. Stencil sizes range from 29 x 29-in (736 x 736mm) all the way up to 29 x 50-in (736 x 1270mm). Minimum board thickness is 0.062-in (1.57mm) with a maximum of 1-in (25.4mm), and a same-size underside clearance is also provided.

    www.cooksonelectronics.com

    Mehr aus News

    Weitere aktuelle Artikel aus der Rubrik News.

    Alle News-Artikel
    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in GermanyFoto: Laurens van der Drift / Unsplash
    News

    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in Germany

    9. November 2026

    German distributor Microtronic has announced it will represent iRaptor LDA and its EYE thermal profiler in Germany. The Portuguese developer's system extends beyond conventional 2D time-temperature profiling by…

    Indium Corporation Presents Solder Materials Research at SMTAI 2026Foto: Indium Corporation
    News

    Indium Corporation Presents Solder Materials Research at SMTAI 2026

    29. Oktober 2026

    Indium Corporation is fielding five specialists at SMTA International 2026 to present new findings on solder paste rheology, BGA ball alloy selection for lower-temperature reflow, and the effect of print gap on paste…

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026Foto: Vishnu Mohanan / Unsplash
    News

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026

    16. Oktober 2026

    KYZEN will exhibit its AQUANOX line of aqueous electronics cleaning chemistries at SMTA International, October 27–29, 2026, highlighting prolonged bath life as a process efficiency and cost-reduction lever for…

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT LinesFoto: Cybord
    News

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT Lines

    29. August 2026

    Fuji America Corporation and Cybord have announced a strategic partnership to embed AI-powered component analytics directly into SMT production lines, enabling 100% real-time inspection of electronic components during…

    ← Zurück zu NewsZur Startseite