As it always was during this event, a full program of seminars of all kinds will be provided during the Semicon Europa. For a complete overview, our readership is kindly asked to contact Semi directly at their web site (address at the end of this article). Here we will just have a short look at some of the highlights and trends. One focus lies on MEMS (micro electro mechanical systems), for which an industry forum takes place. It provides exhibitors an opportunity to show their competence and solutions to interested visitors. The MEMS scenario is shortly characterized by a huge variety of different products, technologies and materials. Typical products are sensors of all kinds, radio-frequency MEMS or tiny mechanical silicon parts. They are applied in virtually all application areas, for example, in vehicles, micro-optics, telecom and IT equipment, and medical/biological solutions. The production is somewhat similar to semiconductor etching, but needs more modular designed and standardized MEMS devices, in order to lower manufacturing costs. During the event, the third international MEMS/MST conference will take place in Munich, and there is also a MEMS pavilion in Hall A2 on the exhibition floors.
Another large field of ongoing developments is packaging, where practically all innovative progress tends to advanced technology such as WLP (wafer-level packaging, flip chip, BGA (ball-grid array), CSP (chip-sized packages) and many more which build on these methods, for example, stacked CSP, wafer-level CSPs, etc. ”We have here an overabundance of varieties that doesn’t provide for cost-efficiency”, explains CEO Franz Richter of Suss Microtec. He sees an intense necessity for standardization in order to provide advanced packages for the volume markets in low-cost versions. Right now, too many different types of packages and processes aren’t helpful for the whole semiconductor community to get the costs down. In the future, some of the process steps in frontend and backend of semiconductor manufacture will have to join. One topical example for this trend is wafer bumping. This packaging process, traditionally a backend task, moves to the end of the wafer processes in the frontend area. Semi/Prismark market research says that the number of bumped wafers will grow from 2001 up to 2006 by a factor of 7 to a total of 23m wafers. Solutions for the backend processes (assembly, packaging and test) will be on showcase in the halls A1/A2.
Facility automation is a further outstanding subject, presented in a pavilion in hall A2. The three main segments of semiconductor manufacture are on display – equipment, facility management and information technology. A joint demonstration of processes and solutions encompasses all relevant subjects of a real factory: wet-bench, process-gas, chemicals and purified water handling, safety and control systems as well as alarm systems, factory networks and control-room equipment. The focus is on clean-room operation and the auxiliary systems, and how to automate work procedures efficiently.





