NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
Technic has released a video highlighting a recent full-service installation of its Circudep Black Knight colloidal graphite metallization system, demonstrating integrated chemistry and equipment delivery for PCB…
Ventec International's tec-thermal range now spans more than a dozen IMS material grades, covering thermal conductivities from 2.2 W/mK up to 16 W/mK, with multi-layer capability via resin-coated foil and film options.
Ventec International has established Ventec Giga, a dedicated division providing end-to-end PCB manufacturing equipment and services to customers in EMEA, the Americas and Asia.