The company will feature the following products:
Formic Acid Soldering Technology (FAST) is a suite of solder materials developed for reflow under formic acid. Product offerings, including preforms, InFORMS, and flux-free solder pastes, enable ultra-low-voiding, high-reliability solder joints with no post-reflow cleaning required, ideal for efficient manufacturing of next-generation power electronics.
InFORMS are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms. This is a key enabler for power module applications, including package-attach to cooler, where the balance of performance and cost of ownership is critical.
InFORCE MF is a proven pressure Ag sinter paste designed for SiC die-attach application and is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
InFORCE 29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE 29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
InBAKE 29 is a Cu sinter paste developed for power discrete die-attach applications and for applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperatures. It is specifically designed for pressureless, batch oven sintering.
AuLTRA Die-Attach Preforms are a gold-based solution that offers superior quality, ensuring optimal performance in critical, high-reliability die-attach applications for power electronics devices. They adhere to strict tolerances with precise solder volumes, yielding excellent bondline thickness control, solder bonding, and thermal transfer.
Durafuse HT is an innovative high-temperature lead-free paste that is ideal for discrete power electronics devices. Durafuse HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than those of a high-Pb solder.
