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    Advanced process verification
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    News

    Advanced process verification

    Solderstar, a global leader in thermal profiling innovations; will exhibit at APEX EXPO 2026, taking place from March 17–19 at the Anaheim Convention
    Veröffentlicht
    09. März 2026
    Lesezeit
    2 Minuten
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    News

    The solutions on display include the VP10 Thermal Profiler and VP Shuttle Verification Fixture for vapor phase soldering, together with the WaveShuttle O2 for wave soldering. These systems extend traditional temperature profiling by enabling verification of the soldering process itself. By capturing multiple parameters in a controlled and repeatable way, the company’s verification tools support machine qualification, routine process checks and ongoing production control, helping manufacturers distinguish between machine-related variation and product-specific behavior.

    Keith Blakley, Sales Manager at the company, commented: “APEX EXPO provides an important opportunity to discuss how manufacturers are moving beyond basic profiling towards a more structured approach to process verification. The newest additions to our portfolio are designed to give engineers reliable, measurable insight into how their soldering processes perform in everyday production. We are looking forward to meeting visitors on the stand and discussing how these tools are being applied in real manufacturing environments”

    A key focus at the stand will be Solderstar’s new vapor phase verification suite, combining the VP10 Thermal Profiler with the VP Shuttle Verification Fixture. The VP10 Thermal Profiler features a low-profile design measuring just 37 mm in height, allowing it to pass easily through vapor phase systems while providing ten measurement channels to capture detailed thermal data across high-mass components, small passives and critical board areas. The VP Shuttle Verification Fixture is a dedicated tool for vapor phase machine qualification, assessing temperature uniformity across the oven work zone using fixed, repeatable measurement points to confirm stable and consistent heating conditions independent of individual PCB designs.

    Also on display will be the WaveShuttle O2, the company’s latest verification solution for wave soldering. Building on the established WaveShuttle platform, the system adds real-time oxygen measurement to a single-pass, multi-parameter verification approach. Alongside oxygen concentration, WaveShuttle O2 measures temperature profile, wave contact, height, line speed, inclination angle and process vibration. This allows engineers to verify nitrogen inerting performance, correlate solder quality with atmospheric conditions and identify machine-related instability such as conveyor issues or excessive vibration, particularly in lead-free wave soldering processes.

    All solutions integrate with the company’s SLX datalogger platform, providing a unified approach to profiling and verification across multiple soldering technologies. This supports audit requirements, long-term process control and repeatable production outcomes across different machines and product types.

    www.solderstar.com

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