A variety of courses and workshops will be available, including topics on electronics manufacturing digitalization, component shortages, fan-out wafer level packaging, and additive printing. Special keynote presentations will also take place throughout this in-person event, covering information on heterogeneous technology, lithium-ion batteries, reliability testing and sustainability, CNF-MIM technology, flexible hybrid electronics and more.
Participants, including scientists, engineers, and students, will all gather under one roof at this international forum to discuss the latest developments and future advances and research on microelectronics packaging. Welcome reception and social events throughout the 4-day event will further expand networking possibilities to talk with the experts of the electronics industry about global challenges, industrial trends and its solutions. Industrial tours will also be offered on the last day of the event, to give participants the chance to visit facilities and institutions, in order to experience it all firsthand.
Since 2006, ESTC has been taking place every two years at different locations throughout Europe. This event continues to give the opportunity for academics and the industry to present, share, and discuss global trends and details regarding semiconductor packaging. This platform ensures a wide range of high-quality information is communicated through an interesting technical program to keep engagement and attention.
