Please register online under: https://www.estc-conference.net/estc-2022/registration
With around 90 oral presentations in more than 20 technical sessions, around 40 interactive presentations (plenary and interactive poster sessions), 10 keynotes, 6 workshops, 4 Professional Development Courses (PDCs), more than 30 exhibitors (presenting themselves additionally in plenary industry pitches), and a company visit to ESTC 2022‘s main sponsor, Continental Automotive Romania, the organizers target to attract more than 300 on-site participants along the supply chain for microelectronics and system integration from industry, research and technology organizations, and academics.
This year’s focus areas are: Advanced Packaging, Materials for Interconnects and Packaging; Reliability of Electronic Devices and Systems; Power Electronics System Packaging, Optoelectronic System Packaging; Assembly and Manufacturing Technologies; RF, mm-wave, and TH Systems Packaging; Flexible, Printed and Hybrid Electronics; Advanced Technologies for Emerging Systems; Design Tools and Modelling; Biomedical Application Packaging; Global Education for Electronics.
Website: www.estc-conference.net/estc-2022
Contact: estc@estc-conference.net
