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    Startseite/Apex-2017/Artikel
    3D solder paste inspection & AOI systems
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    Apex-2017

    3D solder paste inspection & AOI systems

    ASC International will exhibit at the IPC APEX Expo, offering live demonstrations of its industry-leading SPI and AOI systems.
    Veröffentlicht
    01. Februar 2017
    Lesezeit
    1 Minute
    Rubrik
    Apex-2017

    ASC International, a leading manufacturer of 3D Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, today announced that it will exhibit in Booth #2727 at the IPC APEX Expo, scheduled to take place Feb. 14–16, 2017 at the San Diego Convention Center.

    The company will offer live demonstrations of ist SPI and AOI systems solutions. On display will be the VisionPro M500 offering low-cost, true 3D bench top SPI. The VisionPro HSi with increased inspection rates for 100 percent high-speed offline SPI and the VisionPro Fusion offers the industry’s only true offline SPI /AOI combination package– all wrapped into a price point similar to single-technology platforms.

    The VisionPro Series of SPI systems incorporates the most advanced, rapid 3D inspection technology coupled with an intuitive Windows 7 OS and packaged in a rugged, bench-top, or stand-alone platform. Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated, making the VisionPro M, AP and HSi series an exceptional value for electronics manufacturers concerned with improving quality and production yields.

    The VisionPro Series of AOI systems incorporates the most advanced, 2D high-resolution sensing technology coupled with an intuitive Windows 7 OS and packaged in a rugged, stand-alone platform. Both image comparison and algorithm based defect detection software provides ease of programming with reliable, low false call rates to maximize performance. The VisionPro AV series offers outstanding ROI with prices too low to publish!

    www.ascinternational.com

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