The highlight of the event for the company is the X7056-II automatic 3D X-ray inspection system, developed with high throughput and image quality for the requirements in high-end electronics production. This AXI in-line system can ensure precise inspection of hidden solder joints and components in high-volume production. It is equipped with the xFastFlow transport module, which cuts printed circuit board changing times. With this feature, up to three boards can be processed at the same time. The new handling design also means that significantly larger board sizes can be inspected and the scope of angled radiation is extended.
Yet another compelling point is the versatile 3D AOI system range: from the premium solution S3088 ultra gold with high image quality, 121 mpixel resolution, and unparalleled defect detection, to the high-performance S3088 ultra chrome for especially high throughput. All 3D systems are based on a combination of intelligent software and an optimum camera concept, so that components and solder joints can be measured in 3D. The result is even more explicit defect identification and fewer false calls, resulting in sustainable quality assurance.
With the vVision operating software, inspection programs for new components and component groups are easily created within a short time. Because of a modern graphical user interface and numerous practical functions with user-friendly basic settings, operation is very intuitive. This is the company’s answer to the requirements facing medium-sized companies in particular: small lot sizes, more frequent production changes, component miniaturization, and efficient personnel deployment.
The company also meets the demand for major global enterprises to integrate their inspection systems into Industry 4.0 process lines – networking systems and master computers in different standards is possible. Within the context of big data, the systems furnish large volumes of information for external evaluations.
Visitors to the show can also gain insight into the company’s expertise and know-how in two presentations: in the PCB & EMS Speakers Corner regarding the topic „How Big Data in Electronic Assembly Inspection Shortens Time-to-Market“ and in the SMT Speakers Corner about „Process Control and Highest Quality beyond Optical and X-Ray Inspection“.
Additional 3D AOI systems will also be part of the Panasonic and Nokia trade fair exhibitions at their respective stands.
productronica Booth A2.177
