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    3-D solder paste inspection
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    News

    3-D solder paste inspection

    CyberOptics Corporation has introduced SE 300 Ultra, its 100 percent 3-D solder paste inspection system, which provides accurate, repeatable results at
    Veröffentlicht
    07. November 2006
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    1 Minute
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    Additionally, it provides the ability to handle odd-shaped pads, superior paste height accuracy (each measurement calculated using 200 k reference points) and an XML file format output for easy integration with shop floor control systems. The system also features paste height, area and volume measurements with Gage R&R <10 percent.

    During 2006, new features have been added to the inspection system, including technology-leading 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits, easy-to-use Operator Interface and Defect Review, and conveyor auto-width adjustment capability.

    www.cyberoptics.com

    EPP Europe 457

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