“Shipping the 11th dispensing system to DancoTech is a key milestone for Asymtek,” states Asymtek’s Global Account Manager, Lars Nielsen. The Spectrum S-900N Series dispensing system is designed with maximum flexibility, configurable for a wide variety of applications. It can handle high-volume applications, such as edge- and corner-bonding that do not require heat, and can be configured with up to three heat stations for applications that require heat, such as flip chip and CSP underfill. With its scalable configuration, the Spectrum S-900N platform can be configured with single or dual lanes depending on capacity requirements. As process needs change, the system can be upgraded to add options not previously required.
DancoTech, a member of WDH Group, is focused on the development and production of microelectronic components with expertise in chip stacking, fine-pitch wire bonding, flip-chip and fine-line surface mount adhesive device applications.
EPP EUROPE 415
